BOC Cryospeed

Argon

Features

  • Refrigerated liquid gas
  • Boiling point -186°C
  • Non-flammable
  • Heavier than air
  • Inert at most temperatures and pressures
  • Colourless and odourless

Specification

  • Argon 99.999%
  • Oxygen <2vpm
  • Moisture <1vpm
  • Nitrogen <6vpm

Product Applications

Electronics In the semiconductor industry, argon is used in a number of device fabrication steps but its largest volume use is as a protective atmosphere in the manufacture of single crystal silicon by a number of processes known as crystal pulling. The single crystal is then sliced into thin wafers for subsequent processing into semiconductor chips.
Fabrication Argon is used as a shielding gas for MIG and TIG Welding processes and plasma-cutting. Argon is used alone or mixed with other gases such as helium, carbon dioxide, oxygen, nitrogen or hydrogen. Each mixture is often specific to welding a particular material or to a particular process.
Lasers Argon can be used for the assist gas for the laser cutting of titanium as well as laser welding in CO2, ND:YAG and Diode machines.
Metals Argon is used to exclude atmospheric air from contact with metals and
metal alloys that will either react with nitrogen contained in the air or take
it into solution.
Spectrographic analysis Arc-spark analysis uses argon in the process of measuring the characteristic
wavelength of light generated by striking an arc onto the metallic sample
being analysed.

Industrial argon is also available in certain geographies. To give better penetration as a shielding gas, it contains 2% oxygen. This is mixed with varying proportions of CO2 for MIG welding and used on its own for TIG welding.

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